CAPABILITIES

 

Our state-of-the-art machinery provides the capability to

manufacture your electronic assemblies using SMT, 

ball grid array/micro-BGA placement, and wave solder thru-hole technologies. We use premium unleaded (RoHS) and leaded solder.

 

Our capabilities include, but are not limited to:

  • PCB assembly with 01005 chips

  • Micro-BGA placement

  • LEDs, QFPs, QFNs, CSPs

  • Melfs, Electrolytic Capacitors, Shields

  • Odd-forms and Connectors up to 3” in length

  • RoHS Wave Solder

  • Thru-Hole

  • Electro-Mechanical Assembly

 

SURFACE MOUNT

THRU-HOLE

 
 

BALL GRID ARRAY

 
MECHANICAL ASSEMBLY
OUR PROCESS

We offer support throughout the entire process. Referrals available for third party assistance using trusted vendors. 

Quick 5-day turnaround with components you supply.

 Standard turn time is 2-3 weeks, dependent upon complexity and component availability.

3220 Commander Drive,
Suite 101 
Carrollton, TX 75006
USA

972-243-8255 Office 

972-243-8730 Fax

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