Our state-of-the-art machinery provides the capability to
manufacture your electronic assemblies using SMT,
ball grid array/micro-BGA placement, and wave solder thru-hole technologies. We use premium unleaded (RoHS) and leaded solder.
Our capabilities include, but are not limited to:
PCB assembly with 01005 chips
LEDs, QFPs, QFNs, CSPs
Melfs, Electrolytic Capacitors, Shields
Odd-forms and Connectors up to 3” in length
RoHS Wave Solder
BALL GRID ARRAY
We offer support throughout the entire process. Referrals available for third party assistance using trusted vendors.
Quick 5-day turnaround with components you supply.
Standard turn time is 2-3 weeks, dependent upon complexity and component availability.